Projects
Projects: Projects for Investigator |
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| Reference Number | EP/X016463/1 | |
| Title | Direct cold sintering of functional ceramics onto polymer circuit boards: a new low energy manufacturing route in electronics | |
| Status | Started | |
| Energy Categories | Not Energy Related 95%; Energy Efficiency(Industry) 5%; |
|
| Research Types | Basic and strategic applied research 100% | |
| Science and Technology Fields | PHYSICAL SCIENCES AND MATHEMATICS (Chemistry) 50%; ENGINEERING AND TECHNOLOGY (Electrical and Electronic Engineering) 50%; |
|
| UKERC Cross Cutting Characterisation | Not Cross-cutting 100% | |
| Principal Investigator |
Dr IM Reaney No email address given Engineering Materials University of Sheffield |
|
| Award Type | Standard | |
| Funding Source | EPSRC | |
| Start Date | 20 October 2022 | |
| End Date | 19 September 2024 | |
| Duration | 23 months | |
| Total Grant Value | £202,342 | |
| Industrial Sectors | No relevance to Underpinning Sectors | |
| Region | Yorkshire & Humberside | |
| Programme | NC : Engineering | |
| Investigators | Principal Investigator | Dr IM Reaney , Engineering Materials, University of Sheffield (100.000%) |
| Industrial Collaborator | Project Contact , Pennsylvania State University, USA (0.000%) Project Contact , Lucideon Ltd (0.000%) Project Contact , Parallel Wireless UK Ltd (0.000%) |
|
| Web Site | ||
| Objectives | ||
| Abstract | Cold sintering is an emerging technology that permits densification of ceramics, ceramic/polymer and ceramic/metal composites at temperatures as low as 100 degrees C. A transient liquid is added to the ceramic powder which is then pressed and heated. Particle-sliding, dissolution and re-precipitation result in densification and the low temperatures enable co-sintering with polymers, metals and dissimilar ceramics. Metallised-polymer printed circuit boards (e.g. FR4 PCBs) are the basis of modern electronics. The metallisation is partially etched away and the required functional and passive components are soldered into position using 'pick and place' technology. Ceramic components such as varistors, thermistors and patch antennas are manufactured separately at high temperatures (>1100 degrees C) and are assembled on the PCB. Here, we propose a radically different approach in which functional ceramics for the fabrication of components are directly deposited/integrated onto the PCB through a cold sintering process at <150 degrees C, reducing the need for energy intensive manufacturing of separate ceramic components. The overall aim is to develop a disruptive technology that reduces both the cost and energy involved in the fabrication of printed circuits for modern consumer electronics | |
| Publications | (none) |
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| Final Report | (none) |
|
| Added to Database | 21/12/22 | |
